Low-temperature curing of a nitrile-epoxy adhesive. Final report

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Abstract
Adhesive strength and glass transition temperature were correlated with cure times at 85/sup 0/C and above. The effect of moisture on adhesive cure and strength was tested. With a 3-hour cure at 85/sup 0/C, lap shear strength met specification requirements. The adhesive was found to absorb moisture with time, especially if one or both polyethylene covers are removed. Placing the adhesive in a desiccator for 30 minutes produced excellent room temperature shear strengths. Preconditioning (removal of moisture) is critical for elevated temperature cures.

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