Laser ablation of parallel optical interconnect waveguides
- 24 April 2006
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 18 (9) , 1106-1108
- https://doi.org/10.1109/lpt.2006.873357
Abstract
Excimer laser ablation is presented as an alternative technology to photolithography for the fabrication of board-level parallel optical interconnect waveguides. Arrays of polymer multimode waveguides with a 50/spl times/50 /spl mu/m/sup 2/ cross section on a 125-/spl mu/m pitch are fully characterized. Root mean square sidewall roughness is 35 nm; no deposition of debris is observed on scanning electron microscope images. The first conclusion out of loss spectrum measurements is a "yellowing effect" of laser ablated waveguides, leading to an increased loss at shorter wavelengths. The second important conclusion is a potential low loss at a wavelength of 850, 980, and 1310 nm. This is verified at 850 nm by cutback measurements on 10-cm-long waveguides showing an average propagation loss of 0.13 dB/cm.Keywords
This publication has 8 references indexed in Scilit:
- Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnectsIEEE Transactions on Electronics Packaging Manufacturing, 2005
- Optical interconnect modules with fully integrated reflector mirrorsIEEE Photonics Technology Letters, 2005
- MT-Compatible Laser-Ablated Interconnections for Optical Printed Circuit BoardsJournal of Lightwave Technology, 2004
- Characterization of parallel optical-interconnect waveguides integrated on a printed circuit boardPublished by SPIE-Intl Soc Optical Eng ,2004
- 3-Gb/s data transmission with GaAs VCSELs over PCB integrated polymer waveguidesIEEE Photonics Technology Letters, 2001
- Experimental demonstration of 2.5 Gbit/s transmissionwith 1 mpolymer optical backplaneElectronics Letters, 2001
- A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systemsIEEE Transactions on Advanced Packaging, 2001
- New technology for electrical/optical systems on module and board level: the EOCB approachPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2000