Simple Technique for Strong Solderable Thin Film Contacts Suitable to 4.2°K
- 1 July 1962
- journal article
- research article
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 33 (7) , 767-769
- https://doi.org/10.1063/1.1717964
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Lead Wire Attachment Technique for Thin Film StudiesReview of Scientific Instruments, 1961
- Special Solder for Use in Cryogenic CircuitsReview of Scientific Instruments, 1959
- Electrodes for thin metal filmsJournal of Scientific Instruments, 1958
- A Technique of Soldering to Thin Metal FilmsReview of Scientific Instruments, 1954