Elemental Surface Composition of Slip Ring Copper as a Function of Temperature
- 1 March 1980
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 3 (1) , 9-12
- https://doi.org/10.1109/tchmt.1980.1135568
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- The Physical Basis for Quantitative Surface Analysis by Auger Electron Spectroscopy and X-Ray Photoelectron SpectroscopyPublished by ASTM International ,1978
- AUGER ELECTRON SPECTROSCOPYPublished by Elsevier ,1975
- Combined Mass Spectrometric and Auger Electron Spectrosopic Techniques for Metal ContactsIEEE Transactions on Parts, Hybrids, and Packaging, 1973
- LEED and Auger investigations of Cu (111) surfaceSurface Science, 1971
- Some Observations of Surface Segregation by Auger Electron EmissionJournal of Applied Physics, 1968
- Electric ContactsPublished by Springer Nature ,1967