Silver migration in thick film conductors and chip attachment resins

• 1 July 1981
• journal article
• Published by Elsevier in Microelectronics Journal
• Vol. 12  (4) , 23-29
• https://doi.org/10.1016/s0026-2692(81)80260-1

Abstract

Keywords

• SILVER MIGRATION
• FILM CONDUCTORS
• ATTACHMENT
• CHIP
• RESINS
• MIGRATION IN THICK