Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method
- 31 July 1993
- journal article
- Published by Elsevier in Engineering Fracture Mechanics
- Vol. 45 (5) , 643-654
- https://doi.org/10.1016/0013-7944(93)90270-3
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Thermal fatigue life of Pb-Sn alloy interconnectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Fracture behavior of 63sn-37pb solderEngineering Fracture Mechanics, 1990