Recovery in low-cycle-fatigued copper single crystals
- 1 March 1989
- journal article
- research article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 110, L9-L11
- https://doi.org/10.1016/0921-5093(89)90180-9
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Strain softening, grain boundary migration and dynamic recrystallization of Ni during high temperature low cycle fatigueActa Metallurgica, 1988
- Dynamic recrystallization during high temperature fatigueScripta Metallurgica, 1986
- The cyclic hardening and saturation behaviour of copper single crystalsMaterials Science and Engineering, 1978
- Recovery and Recrystallization during High Temperature DeformationPublished by Elsevier ,1975
- Cyclic Deformation of Metals and AlloysPublished by Elsevier ,1975