Growth characteristics of copper of tungsten grown through cementation, vapor deposition and electroplating
- 1 June 1979
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 60 (2) , 157-174
- https://doi.org/10.1016/0040-6090(79)90186-x
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
- A field ion microscope study of black chrome and nickel electroplated coatingsThin Solid Films, 1978
- A field-ion microscope study of vapour-deposited platinumThin Solid Films, 1972
- Field emission and field ion microscope studies of the epitaxial growth of nickel on tungstenSurface Science, 1971
- Some properties of thin metal films observed by field-ion and field emission microscopySurface Science, 1968
- A field-ion microscope study of thin films of iridium on molybdenumSurface Science, 1968
- Atomic Structure of Platinum Crystals Electrolytically Overgrown on Field-Ion Microscope TipsJournal of Applied Physics, 1967
- Nucleation and Epitaxial Growth of Cu on WJournal of Applied Physics, 1965
- The adsorption of copper on tungstenProceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, 1965