A new approach to active phased arrays through RF-wafer scale integration
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1223-1226 vol.3
- https://doi.org/10.1109/mwsym.1990.99799
Abstract
A novel approach to active phased array technology is described. Several modules are fabricated at the same time and placed in a layered structure. The layers include the RF modules, cooling manifold, DC bias distribution, RF manifold, and radiating elements. In this configuration, 16 or more T/R (transmit/receive) modules are fabricated on as single 3-in GaAs wafer. The realization of multiple modules on a wafer is made possible by redundancy of circuit elements and novel mechanical switches. Preliminary results on these efforts are presented.Keywords
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