Deposition of thin films of copper on silicon substrates at low temperature by the ICB method
- 1 February 1989
- journal article
- Published by Elsevier in Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
- Vol. 37-38, 874-877
- https://doi.org/10.1016/0168-583x(89)90318-2
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Metallization by ionized cluster beam depositionIEEE Transactions on Electron Devices, 1987
- Formation and properties of the copper silicon(111) interfaceJournal of Vacuum Science & Technology B, 1983