Energy balance via thermal emission in copper under stress

• 29 February 1988
• journal article
• Published by Elsevier in Materials Letters
• Vol. 6  (4) , 133-137
• https://doi.org/10.1016/0167-577x(88)90148-6

Abstract

Keywords

• MECHANICAL ENGINEERING
• MECHANICS OF MATERIALS
• CONDENSED MATTER PHYSICS
• GENERAL MATERIALS SCIENCE