Ultrasonic in-process measurement of silicon wafer thickness

• 1 October 1982
• journal article
• Published by Elsevier in Precision Engineering
• Vol. 4  (4) , 195-199
• https://doi.org/10.1016/0141-6359(82)90005-8

Abstract

Keywords

• SILICON WAFER
• WAFER THICKNESS
• PROCESS MEASUREMENT
• ULTRASONIC IN PROCESS