A Novel Application of the FIB Lift-out Technique for 3-D TEM Analysis

• 1 September 2001
• journal article
• Published by Elsevier in Microelectronics Reliability
• Vol. 41  (9) , 1551-1556
• https://doi.org/10.1016/s0026-2714(01)00174-3

Abstract

Keywords

• FIB LIFT
• TEM ANALYSIS
• NOVEL APPLICATION
• TECHNIQUE