Stress from a parallelepipedic thermal inclusion in a semispace

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Abstract
Many problems concerning stress arising from the embedding of a foreign body in a semi‐infinite matrix can be described as thermal inclusion involving a single or an assemblage of parallelepipedic elements. Because of its basic usefulness, we present an analytical solution to the problem of a parallelepipedic thermal inclusion in a three‐dimensional semispace. Application of this solution to the currently important problem of trench isolations in integrated circuits will be presented separately elsewhere.