Measuring Package and Interconnect Model Parameters Using Distributed Impedance
- 1 December 1992
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Equivalent circuit modeling of interconnects from time domain measurementsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- An inverse scattering framework for several problems in signal processingIEEE ASSP Magazine, 1987