Characteristics of thin-film devices for a stack-type MCM

Publisher Website

2 January 2003

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/mcmc.1992.201474

Abstract

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Keywords

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Fabrication of three-dimensional IC using `cumulatively bonded IC' (CUBIC) technology
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1990