Self-aligned flip-chip packaging of tilted semiconductoroptical amplifier arrays on Si motherboard
- 16 March 1995
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 31 (6) , 488-490
- https://doi.org/10.1049/el:19950293
Abstract
An optical self-aligned flip-chip packaging technique for tilted semiconductor optical amplifier arrays is reported. It uses a Si motherboard with V-grooves for self-alignment between the tilted SOA array and angle polished fibre arrays. Fibre-to-fibre gain of 14 ± 1 dB and ripple ±0.1 dB without antireflection coating on the fibres have been achieved.Keywords
This publication has 3 references indexed in Scilit:
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