Low-cost, high-performance package for a multi-chip MMIC module

• 6 January 2003
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 221-224
• https://doi.org/10.1109/gaas.1988.11062

Abstract

Keywords

• LOW COST
• HIGH PERFORMANCE PACKAGE
• MMIC MODULE
• MULTI CHIP MMIC