Dry etching-based silicon micro-machining for MEMS
- 15 June 2001
- Vol. 62 (2-3) , 279-291
- https://doi.org/10.1016/s0042-207x(00)00442-5
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
- Lithographie der nächsten Generation: Angesichts milliardenschwerer Entwicklungskosten muss die Industrie zwischen vier lithographischen Verfahren auswählenPhysikalische Blätter, 2000
- Dry etching with gas chopping without rippled sidewallsJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1999
- Fabrication of multipurpose AFM/SCM/SEP microprobe with integrated piezoresistive deflection sensor and isolated conductive tipMicroelectronic Engineering, 1998
- Deep ultraviolet resists AZ DX-561 and AZ DX-1300P applied for electron beam and masked ion beam lithographyJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1997
- Fabrication of high aspect ratio structures using chlorine gas chopping techniqueMicroelectronic Engineering, 1997
- Bilayer resist process for exposure with low-voltage electrons (STM-lithography)Microelectronic Engineering, 1996
- Polycrystalline Silicon Micromechanical BeamsJournal of the Electrochemical Society, 1983
- The reaction of fluorine atoms with siliconJournal of Applied Physics, 1981
- Ion- and electron-assisted gas-surface chemistry—An important effect in plasma etchingJournal of Applied Physics, 1979
- The resonant gate transistorIEEE Transactions on Electron Devices, 1967