The work-hardening of copper-silica
- 1 May 1973
- journal article
- research article
- Published by Taylor & Francis in Philosophical Magazine
- Vol. 27 (5) , 1073-1092
- https://doi.org/10.1080/14786437308225818
Abstract
A method is described for the determination of the surface diffusion coefficient in a copper-silica interface. The experimental values thus obtained are applied to a simple model for the relaxation of stresses produced at a silica particle, in a copper matrix, by applied plastic and elastic deformations. The usefulness of the model is examined in terms of its application to the prediction of the conditions under which diffusion-aided relaxation becomes important.Keywords
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