The influence of sodium bromide in the corrosion and passivity of copper in borate buffer
- 1 January 1988
- journal article
- Published by Elsevier in Corrosion Science
- Vol. 28 (2) , 121-134
- https://doi.org/10.1016/0010-938x(88)90089-3
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Stochastic and deterministic behaviours of 316 stainless steel pitting corrosion in phosphate-borate buffer containing sodium chlorideElectrochimica Acta, 1987
- Electrochemical behaviour of copper in potassium thiocyanate solution—II. Analysis of potentiostatic current transientsElectrochimica Acta, 1987
- Electrochemical behaviour of copper in potassium thiocyanate—I. Dissolution, passivation and pitting processesElectrochimica Acta, 1986
- The influence of temperature on the pitting corrosion of copperElectrochimica Acta, 1986
- Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chlorideElectrochimica Acta, 1985
- Corrosion and passivity of copper in solutions containing sodium sulphide. Analysis of potentiostatic current transientsElectrochimica Acta, 1985
- The Pitting Corrosion of Nickel in Different Electrolyte Solutions Containing Chloride IonsJournal of the Electrochemical Society, 1985
- A comparative pitting corrosion study of mild steel in different alkaline solutions containing salts with sulphur-containing anionsCorrosion Science, 1984
- The investigation of the passive behaviour of copper in weakly acid and alkaline solutions and the examination of the passive film by esca and ISSElectrochimica Acta, 1980
- The electrochemical growth of three dimensional nuclei during a potentiostatic pulse—A simulationJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1973