Self-aligned flip-chip assembly of protonic devices with electrical and optical connections
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 780-786
- https://doi.org/10.1109/33.62593
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Image analysis methods for solder ball inspection in integrated circuit manufacturingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Automated inspection of solder bumps using visual signatures of specular image-highlightsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Size, Transparency and Control in Optical Space Switch Fabrics: A 16 × 16 Single Chip Array in Lithium Niobate and Its ApplicationsPublished by Springer Nature ,1990
- 8×8 element hybridised PLZT/silicon spatial light modulator arrayElectronics Letters, 1989
- Thermal stability of various ball-limited-metal systems under solder bumpsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Optimization of Indium-Lead Alloys for Controlled Collapse Chip Connection ApplicationIBM Journal of Research and Development, 1982
- Silicon as a mechanical materialProceedings of the IEEE, 1982
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969