Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
- 1 November 1999
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 43 (3) , 399-415
- https://doi.org/10.1016/s0017-9310(99)00151-9
Abstract
No abstract availableKeywords
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