Exploiting the third dimension in power electronics packaging
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 419-423
- https://doi.org/10.1109/apec.1997.581484
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- A new manufacturing and packaging technology for the integration of power electronicsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- An overview of smart power technologyIEEE Transactions on Electron Devices, 1991