VLSI Packaging Technique Using Liquid-Cooled Channels
- 1 December 1986
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 9 (4) , 328-335
- https://doi.org/10.1109/tchmt.1986.1136661
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Packaging Technology for the NEC SX SupercomputerIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Conduction Cooling for an LSI Package: A One-Dimensional ApproachIBM Journal of Research and Development, 1982
- A Conduction-Cooled Module for High-Performance LSI DevicesIBM Journal of Research and Development, 1982
- Study on Air Cooled Heat Exchanger with Corrugated Fin Surfaces : 2nd Report, Characteristics of Corrugated Straight Fin Surfaces and their Analogous Nondimensional ExpressionsTransactions of the Japan Society of Mechanical Engineers, 1977