Hydrogen Peroxide as a Resin Cure Accelerator
- 1 January 1986
- journal article
- research article
- Published by Taylor & Francis in The Journal of Adhesion
- Vol. 19 (2) , 137-151
- https://doi.org/10.1080/00218468608071218
Abstract
The reaction of hydrogen peroxide with conventional resin adhesives was sufficiently exothermic for the heat to accelerate and improve resin cure in the hotpress. As a consequence, pressing times for medium density fibreboard, particleboard, and plywood could be reduced by up to 30% and, in some cases, better resin cure permitted a reduction in binder level. Differences in the interaction of hydrogen peroxide with various adhesives were observed and a catalyst was found to enhance the exothermic effect. The behaviour of hydrogen peroxide in combination with a tannin-based binder and wood fibre was studied over a wide temperature range. Below 60°C the system was stable. At 70°C the initial reaction was endothermic followed by a slow exothermic reaction. At hotpressing temperatures the exothermic reaction was rapid but controllable. It was concluded that the hydrogen peroxide-tannin-fibre system does not impose an additional safety hazard on medium density fibreboard plant operation.Keywords
This publication has 2 references indexed in Scilit:
- Bonding Wood by Graft Polymerization. The Effect of Hydrogen Peroxide Concentration on the Bonding and Properties of ParticleboardHolzforschung, 1982
- Differential scanning calorimetry of hydrogen peroxide and hydrogen peroxide-treated lignocellulose. I. Ambient pressure conditionsThermochimica Acta, 1980