Ni-B Electroless Plating as Cap Material for Ag Multi-Level Metallization.

• 1 January 2002
• journal article
• Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging
• Vol. 5  (1) , 58-63
• https://doi.org/10.5104/jiep.5.58

Abstract

Keywords

• ELECTROLESS PLATING
• CAP MATERIAL
• LEVEL METALLIZATION
• AG MULTI LEVEL
• MATERIAL FOR AG