Laser direct etching of silicon on oxide for rapid prototyping
- 1 March 1996
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 6 (1) , 49-51
- https://doi.org/10.1088/0960-1317/6/1/009
Abstract
Structures have been etched in poly-silicon and amorphous silicon deposited on silicon oxide by laser direct writing. These patterns can be written with a high resolution and transferred to the underlying material via reactive ion etching. Three-dimensional structures can be obtained by multiple exposure of the silicon mask. Due to the fast turnaround time of direct writing processes, this technique can be applied for rapid prototyping of large-scale structures.Keywords
This publication has 4 references indexed in Scilit:
- Laser machining of silicon for fabrication of new microstructuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Silicon nanostructures produced by laser direct etchingApplied Physics Letters, 1995
- Stereo laser micromachining of siliconApplied Physics Letters, 1992
- Rapid direct writing of high-aspect ratio trenches in silicon: Process physicsJournal of Vacuum Science & Technology B, 1988