Characterization of model anaerobic adhesive cure using real‐time fourier transform infrared spectroscopy and dielectric spectroscopy
- 9 May 1994
- journal article
- research article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 52 (6) , 737-746
- https://doi.org/10.1002/app.1994.070520603
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Dielectric and morphological investigations of phase separation and cure in rubber‐modified epoxy resins: Comparison between teta‐ and DDM‐based systemsJournal of Applied Polymer Science, 1993
- Relaxations in thermosets: 22. Curing kinetics and the dielectric properties of an elastomer containing epoxide cured with AncamidePolymer, 1992
- Relaxations in thermosets. 24. Theory and experiments on nonisothermal curing of thermoset polymersMacromolecules, 1992
- Relaxations in thermosets. XVI. Dielectric studies of negative feedback during curing of an epoxide‐ethylene‐diamine thermosetJournal of Polymer Science Part B: Polymer Physics, 1992
- Relaxations in thermosets. X. Analysis of dipolar relaxations in DGEBA‐based thermosets during isothermal cureJournal of Polymer Science Part B: Polymer Physics, 1991
- Dielectric relaxation spectroscopy and molecular dynamics of a liquid-crystalline polyacrylate containing spiropyran groupsJournal of Materials Chemistry, 1991
- Kinetic study of the cationic photopolymerization of epoxy monomersJournal of Polymer Science Part A: Polymer Chemistry, 1990
- Anaerobic Adhesive Cure Mechanism-IIThe Journal of Adhesion, 1990
- Anaerobic Adhesive Cure Mechanism-IThe Journal of Adhesion, 1990
- Curing characteristics of anaerobic sealants and adhesivesBritish Polymer Journal, 1983