A programming package for the study of high angle grain boundaries by using TEM
- 31 January 1983
- journal article
- Published by Elsevier in Computer Physics Communications
- Vol. 28 (3) , 287-297
- https://doi.org/10.1016/0010-4655(83)90046-2
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- A ?=27 coincidence grain boundary in a Cu-Ni alloyJournal of Materials Science, 1982
- Characterization of grain boundaries in the hexagonal system based on tables of coincidence site lattices (CSL's)Acta Crystallographica Section A, 1982
- A new formulation for the generation of coincidence site lattices (CSL's) in the cubic systemActa Crystallographica Section A, 1981
- Grain boundary analysis in TEM. V. A. Criterion for the identification of a CSL and a characterization of an approximate CSLPhysica Status Solidi (a), 1981
- Grain boundary analysis in TEM III. Determination of conditions for csl and application in copperPhysica Status Solidi (a), 1979
- Grain boundary analysis in TEM. II. A modified O-lattice for CSL and DSC lattice determinationPhysica Status Solidi (a), 1979
- Grain boundary analysis in TEM. I. Practical determination of bicrystal orientationsPhysica Status Solidi (a), 1978
- On the geometry of coincidence-site latticesActa Crystallographica, 1966