Resin-Molded High Frequency Multi-Chip Modules in Face-up Structure.

• 1 January 1998
• journal article
• Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging
• Vol. 1  (1) , 47-52
• https://doi.org/10.5104/jiep.1.47

Abstract

Keywords

• CHIP MODULES
• MULTI CHIP
• FREQUENCY MULTI
• HIGH FREQUENCY
• RESIN MOLDED HIGH