Low Temperature Curing of Polyimide Precursors by Variable Frequency Microwave
- 1 January 2005
- journal article
- Published by Technical Association of Photopolymers, Japan in Journal of Photopolymer Science and Technology
- Vol. 18 (2) , 327-332
- https://doi.org/10.2494/photopolymer.18.327
Abstract
Polyimides are commonly used as a thermally stable insulator for semiconductors. To assure adequate chemical or physical properties, a layer of their precursors has to be cured in a convection oven at more than 300 °C. In this paper, we compare variable frequency microwave (VFM) heating with convection heating for curing various polyimide precursors and a photosensitive polyimide precursor. Then, we demonstrate that the use of VFM enables us to cure the precursor lower than the standard convection cure temperature while maintaining necessary film properties such as cyclization, Tg, Td, and elongation.Keywords
This publication has 9 references indexed in Scilit:
- Efficient Catalyst for Low Temperature Solid-Phase Imidization of Poly(amic acid)Chemistry Letters, 2004
- High mobility of pentacene field-effect transistors with polyimide gate dielectric layersApplied Physics Letters, 2004
- Polyimide Coatings for OLED ApplicationsJournal of Photopolymer Science and Technology, 2004
- Microwave-Accelerated Homogeneous Catalysis in Organic ChemistryAccounts of Chemical Research, 2002
- Variable‐frequency microwave curing of benzocyclobuteneJournal of Applied Polymer Science, 2002
- Variable frequency microwave curing of photosensitive polyimidesIEEE Transactions on Components and Packaging Technologies, 2001
- The percentage of rigid chain length, (PRCL), a new concept for predicting glass transition temperatures and melting points of poly(aryl ether ketones) and poly(aryl ether sulfones)Macromolecules, 1992
- Accelerated imidization reactions using microwave radiationJournal of Polymer Science Part A: Polymer Chemistry, 1992
- A New Transistor with Two‐Level Metal ElectrodesJournal of the Electrochemical Society, 1977