Stress During the Electrodeposition of Copper on Copper Substrate

• 1 January 1955
• journal article
• Published by The Electrochemical Society in Journal of the Electrochemical Society
• Vol. 102  (5) , 226
• https://doi.org/10.1149/1.2430034

Abstract

Keywords

• STRESS DURING THE ELECTRODEPOSITION
• COPPER ON COPPER SUBSTRATE
• ELECTRODEPOSITION OF COPPER ON COPPER