Positive-Working Polyimide Resists Based On Diazonaphthoquinone Photochemistry

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Abstract
Polyimides have many desirable properties for use in the microelectronics industry, including ease of application, excellent planarization capability, and good electrical insulating properties. A polyamic acid that is also an imagable resist simplifies processing by eliminating the need for separate resist application and removal steps. Negative-working polyimide resists are quite common, but there are very few examples of positive-working polyimide-based resists. In this paper, we describe a positive polyimide resist which is based upon a diazonaphthoquinone dissolution inhibitor that is standard in the resist industry. The positive polyimide resist described here has high resolution, high heat resistance, and excellent dielectric properties.

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