Electrodeposition of copper from sulphate solutions — influence of the cations
- 28 February 1989
- journal article
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 21 (2) , 109-122
- https://doi.org/10.1016/0254-0584(89)90106-5
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
- Electrochemical phase formation—I. The electrodeposition of copper on glassy carbonElectrochimica Acta, 1986
- The problem of correction for ohmic potential drop in linear potential sweep experiments and the derivation of s0 values for electrode surface processesElectrochimica Acta, 1985
- Electrochemical nucleationJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1985
- Epitaxial growth and electrode impedance of copper electrodepositsElectrochimica Acta, 1984
- Computer simulation of potentiostatic current-time transients for nickel electrocrystallizationJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1984
- The response of some nucleation/growth processes to triangular scans of potentialJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1983
- The kinetics of silver bromide film formation on the silver anodeElectrochimica Acta, 1982
- The electrocrystallization of nickel on vitreous carbon A kinetic and structural study of nucleation and coalescenceJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1982
- The Formation of Monolayer Metal Films on ElectrodesJournal of the Electrochemical Society, 1974
- Resistance for Flow of Current to a DiskJournal of the Electrochemical Society, 1966