Thermal analysis of integrated circuit devices and packages
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 701-709
- https://doi.org/10.1109/33.49036
Abstract
No abstract availableThis publication has 27 references indexed in Scilit:
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