Phase formation in Cu-Si and Cu-Ge
- 1 October 1991
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 70 (7) , 3655-3660
- https://doi.org/10.1063/1.349213
Abstract
Phase formation and growth kinetics have been investigated with lateral diffusion couples in Cu‐Si and Cu‐Ge systems. Analytical electron microscopy was used to determine the crystal structures and chemical compositions of the growing phases. Cu3Si is found to be the dominant phase in the Cu‐Si system. The growth of the silicide follows a (time)1/2 dependence with an activation energy of 0.95 eV in the temperature range of 200–260 °C. Cu3Ge is the only phase observed in Cu‐Ge lateral diffusion couples with its length up to 20 μm. The growth of Cu3Ge is a diffusion controlled process at a rate similar to that of Cu3Si. The activation energy of Cu3Ge growth is 0.94 eV at 200–420 °C. In Cu‐silicide or Cu‐germanide formation, Cu appears to be the dominant diffusing species.This publication has 12 references indexed in Scilit:
- Copper silicide formation by rapid thermal processing and induced room-temperature Si oxide growthApplied Physics Letters, 1990
- Formation, oxidation, electronic, and electrical properties of copper silicidesJournal of Applied Physics, 1990
- Formation of copper silicides from Cu(100)/Si(100) and Cu(111)/Si(111) structuresJournal of Applied Physics, 1990
- The influence of phosphorus on the solid state reaction between copper and siliconReactivity of Solids, 1988
- The solid state diffusion reaction of copper with germanium; a comparison between silicon and germaniumReactivity of Solids, 1988
- Transmission electron microscopy studies on the lateral growth of nickel silicidesJournal of Applied Physics, 1985
- Silicide formation in lateral diffusion couplesJournal of Vacuum Science & Technology A, 1983
- Lateral diffusion of Ni and Si through Ni2Si in Ni/Si couplesApplied Physics Letters, 1982
- Diffusion of Copper in the Copper‐Silicon SystemJournal of the Electrochemical Society, 1982
- Effect of Compressive Stress on Reaction-Diffusion in the Cu–Si SystemTransactions of the Japan Institute of Metals, 1977