On Possible Thermal Degradation in Spirally Programmed Interconnection Wafer Technology
- 1 March 1981
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 4 (1) , 154-157
- https://doi.org/10.1109/tchmt.1981.1135775
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Wafer-scale integration-a fault-tolerant procedureIEEE Journal of Solid-State Circuits, 1978
- Computerized Thermal Analysis of Hybrid CircuitsIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- An Approach to Highly Integrated, Computer-Maintained Cellular ArraysIEEE Transactions on Computers, 1977
- A new look at yield of integrated circuitsProceedings of the IEEE, 1970