Hybrid e-beam/deep UV exposure using portable conformable masking (PCM) technique
- 1 November 1979
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science and Technology
- Vol. 16 (6) , 1669-1671
- https://doi.org/10.1116/1.570269
Abstract
A thin dichroic resist or an opaque metal is directly applied to a deep-UV resist and is delineated with an e-Beam exposure tool conventionally. This intimately contacted pattern now serves as a portable mask that can be carried with the wafer to a deep-UV blanket exposure station for delineation of the deep-UV resist to produce high aspect ratio images with controlled profiles. In particular, AZ1350J/PMMA and AZ1350J/aluminum/PMMA systems are discussed. Sample results showing submicrometer PMMA images in thicknesses ranging from 1.6 to 1.9 μm using a 0.2 μm thick AZ PCM and 0.3-μm-thick aluminum PCM are presented.Keywords
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