Ceramics and Glass-Ceramics in Electronic Packaging
- 1 January 1990
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
An overview of ceramic packaging as it evolved over the last two decades from dual-in-line packages to state-of-the-art multilayer multichip packages ispresented. IBM's 69 layer glass-ceramic/copper multilayer multichip substrate with dielectric constant of 5.0, thermal expansion exactly matching silicon and exceptional dimensional control is summarized.Keywords
This publication has 1 reference indexed in Scilit:
- Microelectronics Packaging HandbookJournal of Electronic Packaging, 1989