Electron Microprobe Techniques for Failure Analysis of Silicon Planar Devices

• 1 November 1967
• conference paper
• Published by Institute of Electrical and Electronics Engineers (IEEE) in Fourth Annual Symposium on the Physics of Failure in Electronics
• No. 07350791,p. 193-200
• https://doi.org/10.1109/irps.1967.362412

Abstract

Keywords

• FAILURE ANALYSIS
• SILICON
• INTEGRATED CIRCUIT METALLIZATION
• GOLD
• ALUMINUM
• CHARACTER GENERATION
• ELECTRON EMISSION
• QUALIFICATIONS
• LABORATORIES
• CHEMICAL ANALYSIS