A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
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- 14 January 2003
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Components Letters
- Vol. 13 (1) , 21-23
- https://doi.org/10.1109/lmwc.2002.807713
Abstract
A novel technique for suppressing power plane resonance at microwave and radio frequencies is presented. The new concept consists of replacing one of the plates of a parallel power plane pair with a high impedance surface or electromagnetic band gap structure. The combination of this technique with a wall of RC pairs extends the lower edge of the effective bandwidth to dc, and allows resonant mode suppression up to the upper edge of the band-gap. The frequency range for noise mitigation is controlled by the geometry of the HIGP structure.Keywords
This publication has 4 references indexed in Scilit:
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