Target Erosion Pattern in Planar Magnetron Sputtering

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Abstract
Two methods for visualizing the target erosion pattern in the planar magnetron sputtering system are described here. The experimental results obtained by one of the new methods reveal that there exists a threshold vertical magnetic field corresponding to the erosion pattern boundaries. The effect of the working pressure and of the cathode potential on the erosion pattern is explained in terms of the mean free path and the initial velocity of the secondary electrons, respectively.

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