An Ultrasonic Evaluation and Quality Control Tool for Adhesive Bonds
- 1 January 1980
- journal article
- Published by Taylor & Francis in The Journal of Adhesion
- Vol. 10 (4) , 293-316
- https://doi.org/10.1080/0021846808544635
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Ultrasonic wave and moduli changes in a curing epoxy resinExperimental Mechanics, 1978
- Ultrasonic attenuation effects associated with the physical modeling of adhesive bondsJournal of Applied Physics, 1977
- Principles and Application of Ultrasonic Spectroscopy in NDE of Adhesive BondsIEEE Transactions on Sonics and Ultrasonics, 1976
- The Relative Operating Characteristic in PsychologyScience, 1973
- Stress Distribution in Bonded Joints *Journal of Composite Materials, 1971