Tensile behavior of pb-sn solder/cu joints
- 1 May 1987
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 16 (3) , 203-208
- https://doi.org/10.1007/bf02655488
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Observations of Precipitates In 95PB-5SN SolderProceedings, annual meeting, Electron Microscopy Society of America, 1985
- Dissolution of Solid Copper into Molten Tin under Static ConditionsTransactions of the Japan Institute of Metals, 1980