Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount package
- 1 January 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 20 (3) , 280-285
- https://doi.org/10.1109/95.623022
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
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