A new LSI bonding technology 'Micron bump bonding assembly technology'

• 1 January 1988
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 23-27
• https://doi.org/10.1109/emts.1988.16142

Abstract

Keywords

• BUMP BONDING
• BONDING TECHNOLOGY
• MICRON
• ASSEMBLY TECHNOLOGY
• NEW LSI BONDING