Improved performance of quantum cascade lasers through a scalable, manufacturable epitaxial-side-down mounting process
- 17 March 2006
- journal article
- research article
- Published by Proceedings of the National Academy of Sciences in Proceedings of the National Academy of Sciences
- Vol. 103 (13) , 4831-4835
- https://doi.org/10.1073/pnas.0600859103
Abstract
We report substantially improved performance of high-power quantum cascade lasers (QCLs) by using epitaxial-side-down mounting that provides superior heat dissipation properties. We used aluminum nitride as the heatsink material and gold–tin eutectic solder. We have obtained continuous wave power output of 450 mW at 20°C from mid-IR QCLs. The improved thermal management achieved with epitaxial-side-down mounting combined with a highly manufacturable and scalable assembly process should permit incorporation of mid-IR QCLs in reliable instrumentation.Keywords
This publication has 9 references indexed in Scilit:
- Comparison Between Epi-Down and Epi-Up Bonded High-Power Single-Mode 980-nm Semiconductor LasersIEEE Transactions on Advanced Packaging, 2004
- Continuous-wave operation of λ∼4.8μm quantum-cascade lasersat room temperatureApplied Physics Letters, 2004
- High-temperature, high-power, continuous-wave operation of buried heterostructure quantum-cascade lasersApplied Physics Letters, 2004
- Continuous Wave Operation of a Mid-Infrared Semiconductor Laser at Room TemperatureScience, 2002
- Continuous wave operation of a 9.3 μm quantum cascade laser on a Peltier coolerApplied Physics Letters, 2001
- Improved CW operation of quantum cascade lasers with epitaxial-side heat-sinkingIEEE Photonics Technology Letters, 1999
- Quantum Cascade LaserScience, 1994
- Some aspects of bonding-solder deterioration observed in long-lived semiconductor lasers: Solder migration and whisker growthJournal of Applied Physics, 1984
- Superlattice and Negative Differential Conductivity in SemiconductorsIBM Journal of Research and Development, 1970