Factors That Affect Uniformity of Plating of Through‐Holes in Printed Circuit Boards: I . Stagnant Fluid in the Through‐Holes
- 1 May 1985
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 132 (5) , 1050-1054
- https://doi.org/10.1149/1.2114013
Abstract
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