Specific preparation procedures for failure analysis of (sub)micron areas in silicon devices
- 30 September 1993
- journal article
- Published by Elsevier in Ultramicroscopy
- Vol. 52 (1) , 127-140
- https://doi.org/10.1016/0304-3991(93)90026-t
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Recent Developments in the use of the Tripod Polisher for TEM Specimen PreparationMRS Proceedings, 1991
- Defect formation in silicon at a mask edge during crystallization of an amorphous implantation layerJournal of Applied Physics, 1989
- A Grinding/Polishing Tool for TEM Sample PreparationMRS Proceedings, 1987